Shenzhen Chaogu Optoelectronics Co., Ltd. releases the 3572 flexible UV adhesive for headphone solder joint protection
Shenzhen Chaogu Optoelectronics Co., Ltd. (“Chaogu”), a Guangdong based manufacturer of UV curable adhesives for electronics, has released the 3572 flexible UV adhesive, a single component formulation developed specifically for protecting headphone solder joints and fixing small electronic components in compact audio devices. The new grade combines strong adhesion with a soft, elastic cured film, addressing one of the most common failure points in earphone and headphone production: cracked solder joints caused by cable flexing, hinge movement and drop impact.
According to field data collected from consumer audio assembly lines, a significant share of headphone returns is traced to mechanical stress at the solder pad rather than to electrical defects. Rigid encapsulation materials protect the joint initially but transfer stress to the solder fillet, which eventually cracks. The 3572 flexible UV adhesive was formulated by the Chaogu R&D team to solve this problem by remaining flexible throughout the service life of the product.
Key performance features
- High adhesion with flexibility – bonds to solder, copper, FR4, plastics and anodized aluminium while retaining elasticity, so repeated bending of earphone cables does not crack the encapsulation.
- 200% elongation at break – the cured adhesive stretches to twice its original length, absorbing vibration, drop impact and cable movement.
- Low shrinkage – volumetric shrinkage below 2% keeps stress away from tiny solder pads and voice coil leads, protecting acoustic performance.
- Fast UV LED curing – cures in 10 to 20 seconds under 365 nm or 395 nm UV LED systems, matching high speed assembly lines and reducing work in progress.
- Compatibility with compact designs – available in flowable and thixotropic versions for gap filling or vertical wire tacking in narrow housings.
Typical technical data
| Parameter | Value |
|---|
| Appearance | Transparent liquid |
| Viscosity (25 °C) | 3000 - 6000 mPa.s |
| Density | 1.02 ± 0.05 g/cm³ |
| Elongation at break | ≥ 200 % |
| Shore hardness | A 55 - 65 |
| Shrinkage | < 2 % |
| Cure wavelength | 365 nm / 395 nm UV LED |
| Service temperature | -40 °C to +120 °C |
| Shelf life | 12 months, unopened |
Where the grade is used
The 3572 is recommended for encapsulation of headphone and earphone solder joints, fixing of speaker drivers and voice coils, strain relief of fine wires and flexible circuits, and protection of connectors and sensors in wearable devices. Because the cured film stays transparent, visual inspection of the joint remains possible after curing, which simplifies quality control on the line.
The product is also compatible with the wider Chaogu electronics adhesive range produced by the same Shenzhen factory, including the 352 UV adhesive for PCB component fixing, which provides moisture proofing and electrical insulation for rigid board applications. Together the two grades cover both rigid and flexible bonding requirements in consumer electronics assembly.
Availability and support
The 3572 flexible UV adhesive is supplied in 30 ml and 250 ml light proof bottles, with custom viscosity, cure speed and packaging options available for OEM projects. All shipments are supported by RoHS, REACH and ISO 9001:2015 documentation. Shenzhen Chaogu Optoelectronics technical staff assist customers with dispensing parameters, cure window settings and joint design reviews to shorten qualification cycles.
Samples are available for evaluation. Buyers and engineers working on headphone, TWS earbud or wearable projects are invited to contact the Shenzhen Chaogu Optoelectronics team with their application details to receive a recommended grade and a test sample.
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